<blockquote lang='kakut'></blockquote>
      1. 20年專注電子焊接東莞市綠志島金屬有限公司
        全國咨詢熱線:135-2799-2739
        綠志島新聞中心-錫膏、焊錫條、焊錫絲
        聯系我們
        聯系人:曾經理
        手機:135-2799-2739
        電話:0769-38893080
        郵箱:anson@lacasitadepalomar.com
        地址:東莞市石排鎮田邊村石貝工業區
        産品動态

        最新推出無鉛中溫Sn/Bi/Cu合金錫膏—PF-3005-C

        作者:張建斌 2021-10-19 0

        綠志島金屬有限公司最新推出無鉛中溫Sn/Bi/Cu合金錫膏,型号:中溫錫膏PF-3005-C具特性如下:

        1. 熔點低(146190℃),焊接溫度接近錫鉛錫膏,對元器件和闆材耐熱性要求低,生産工藝窗口大;

        2. 相對于目前常用的無鉛合金錫膏(如Sn/Ag/CuSn/Bi/Ag),成本低;

        3. 熱導性好,在散熱模組産品上應用此産品,其熱導率比Sn/Bi合金增高一倍左右;

        4. 此合金機械強度接近Sn/Ag/Cu合金。

        4. 此産品采用球形度好、顆粒度分布均勻的錫粉煉制而成,粘度适中,适應各種塗布方法;

        5. 印刷滾動性、脫膜性及抗坍塌性均表現優良,可有效解決密間距和小元件的焊盤印刷;

        6. 潤濕性好,能适應不同的金屬鍍層;焊後闆面殘留極少且透明、阻抗高,焊點平滑飽滿;

        7. 此款合金錫膏可作爲Sn/Ag/Cu合金(表面貼裝和通孔塗布工藝)及Sn/Bi(散熱模組)類型産品的替代品;可有效地緩解焊料行業中對Ag需求的劇烈增加和避免無鉛的高溫焊接;解決了Sn/Bi焊料在散熱模組産品上的低熱導問題。


                Legret metal Co., Ltd. launches the middle temperature Lead-free solder paste Sn/Bi/Cu newly. Its characteristics are as follows:

        1. Lower melting point, weld temperature is close to the Sn/Pb solder paste.Lower heat-resistant requirements of the components and panels, the production technology window are larger;

        2. Lower cost to the common Lead-free solder paste that currently used (such as Sn/Ag/Cu or Sn/Bi/Ag);

        3. Good thermal conductivity, using this product on the products of mould group of heatsink, its heat conduction rate increases by about one time than Sn/Bi alloy;It shows good thermal conductivity. Its heat conduction rate increases by about one time of the Sn/Bi alloy's when used on the mould group of heatsink. 

        4. The mechanical intensity of this alloy is close to Sn/Ag/Cu.


        附本錫膏應用案例:

        1、應用于散熱器的焊接

        2、應用于表面貼裝

        電路闆

          <blockquote lang='kakut'></blockquote>